ESD-safe
In environments where a single static discharge can cause costly damage, regulation is everything. Controlled dissipation, material consistency, and uncompromising reliability make ESD-safe 3D printing essential for sensitive environments from prototype to end-use component.
Advantages
Smarter parts, fewer limits.
Shape ESD-safe parts exactly around your process, not the other way around. From PCB trays that follow your specific board outline to jigs, fixtures, and housings tailored to your devices, every contour, cutout, and contact point can be customized for your line.
Create ESD-safe prototypes, facilitating more rapid design revisions and advancements. This shortens the time it takes for ESD-sensitive devices to go on sale by speeding up the product development cycle.
Produce complex PCB trays, jigs, fixtures, and conformal housings with integrated channels, internal routing, and lightweight lattice structures that combine mechanical stability with controlled static dissipation. Together, these capabilities allow tailored ESD-safe solutions from protective packaging to production tooling.
Possibilities
ESD-safe materials are widely used for custom PCB trays, component organizers, and inlays that safely move boards between assembly, testing, and packaging without risking static damage. Example: stackable, labeled trays for SMT lines, each tailored to a specific board outline and connector layout so operators can handle sensitive electronics with confidence.
In assembly and test stations, ESD-safe jigs and fixtures hold devices in place while providing controlled static dissipation at all contact points. Example: a custom test fixture that positions a handheld device precisely, integrates cable management channels, and ensures any charge on the housing is safely dissipated during flashing, calibration, or functional testing.
ESD-safe materials are used for workbench accessories, equipment housings, and protective covers in EPA (ESD Protected Areas). Example: tailored tool holders, instrument enclosures, or scanner brackets that attach directly to production lines, combining ergonomic positioning with safe static removal wherever operators interact with sensitive electronics.
Materials
Formula1B is a rigid, static-dissipative photopolymer resin. It uses a urethane methacrylate base that include a stable dispersion of discrete functionalized carbon nanotubes (D’Func) to yield consistent surface resistance and enhances key mechanical performance properties such as Tensile Strength, Flexural Strength, and Impact Resistance.
It delivers isotropic surface resistance of 10^6 to 10^7 Ω, enabling uniform static dissipation across all axes without carbon sloughing or z-axis failures. Key mechanical properties include tensile strength of 95 MPa, Young's modulus of 3300 MPa, elongation at break of 5.3%, and impact strength of 22 J/m.
Paired with Formula1B, the Nexa3D® XiP Pro delivers a high-performance solution for producing rigid, isotropic, ESD-safe components such as jigs, fixtures, and carriers with exceptional detail and accuracy. The XiP Pro is a next-generation industrial resin 3D printer, offering the largest build volume, fastest print speed, and highest throughput in its class at low operating costs. Its modern, LCD-based VAT photopolymerization process, featuring patented Lubricant Sublayer Photocuring (LSPc) technology.
Materials
Printable with
C-Lite® is a high-temperature, static-dissipative photopolymer resin formulated with a stable dispersion of discrete functionalized carbon nanotubes (D’Func) to deliver reliable electrostatic discharge (ESD) performance. Printed components can withstand service temperatures up to 250°C, exhibit excellent surface finish and fine detail, and have passed NASA ASTM E595-77/84/90 outgassing tests. With isotropic ESD performance of 10⁶–10⁷ Ω, C-Lite® is ideal for demanding applications in electronics, semiconductor manufacturing, and the automotive industry.
When combined with the Nexa3D® XiP Pro, a high-throughput industrial resin printer featuring LSPc (Lubricant Sublayer Photo‑curing) technology, C-Lite® enables the production of large, precise, and ESD-safe parts quickly and consistently. The XiP Pro’s 7K LCD optics, open-material platform, and expansive build volume support scalable production at speeds up to 24 cm/hour with 46 µm resolution, making it an excellent solution for durable, heat-resistant components in professional and industrial settings.
Materials
Printable with
Stratasys® ABS-ESD7 (Acrylnitril-Butadien-Styrol ESD7) is an ABS-based thermoplastic filament designed to safely dissipate static electricity. It helps prevent charge buildup, electrostatic discharge, and the attraction of dust or particles, while offering a tensile strength of 36 MPa, a flexural strength of 61 MPa, and a heat deflection temperature of 82 °C. This makes it well suited for prototypes, electronic carriers, fixtures, and other electrostatically sensitive parts.
Together with the Stratasys® F900™, a production-grade FDM® 3D printer, ABS-ESD7 enables the high-throughput manufacturing of large, robust parts. The F900™ offers the largest build volume in its class – 914 × 610 × 914 mm (36 × 24 × 36 in.) – and supports layer resolutions from 0.127 to 0.508 mm, making it well-suited for producing jigs, fixtures, tooling, and end-use components with both precision and durability.
Materials
Stratasys® Antero™ 840CN03 is a PEKK-based, ESD thermoplastic offering ~95 MPa tensile strength, excellent heat and chemical resistance, low outgassing, and a lightweight alternative to metal. It prints on high‑temperature FDM® systems to produce custom parts with consistent static‑dissipation properties (surface resistivity ~10^4–10^9 Ω/sq) and reliable chemical durability.
Combined with the Stratasys® F900™, the ultimate 3D production printer for demanding manufacturing, these high-performance parts can be produced efficiently and accurately. The F900™ features the largest build platform in its class, high repeatability, maximum accuracy and high throughput. With a wide range of materials to choose from – from high-performance polymers to engineering thermoplastics – it enables the production of durable, consistent and precise components. Powerful control software, an integrated camera, GrabCAD Print™, Insight™ and MTConnect optimize workflow, reliably monitor jobs and increase the efficiency of the production process.
Materials
Forward AM Ultrasint® PA11 ESD is a bio-based polyamide 11 powder developed for powder bed fusion processes, offering electrostatic discharge properties for enhanced process safety when handling sensitive electronics. The castor oil-derived nylon provides high tensile strength and elasticity, combined with good chemical resistance and stable ESD performance; typical tensile strengths range from approximately 55–65 MPa depending on build orientation and conditioning, with slightly lower values in the conditioned state. Parts made from Ultrasint® PA11 ESD feature reduced surface and volume resistivity compared to non-functionalized PA11 powders, allowing electrostatic charges to dissipate efficiently, while the thermal properties enable use in demanding engineering applications. Typical applications include functional prototypes, housings, and electronic components in ESD-sensitive environments.
Printed on the Nexa3D® QLS 260, a productivity-oriented SLS 3D printer with a 60 W CO₂ laser, Ultrasint® PA11 ESD can be processed efficiently at an industrial scale. The system is designed for short cycle times and high throughput, supports a wide range of high-temperature thermoplastics and other powders, and provides a cost-efficient foundation for industrial SLS production thanks to low powder refresh rates and an open material platform.
Materials
Printable with
Use Cases
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